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Ultra-Flat SiNx Coated Substrates Size:10 x 10mm pieces in a Gel-Pak® box Hot embedding press is needed

SKU: 97801830791

4.5
EUR379.73 EUR411.73

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Ships within 48 hours · Estimated delivery Aug 18 - Aug 23

Description

Hot embedding press is needed to use this embedding material

Universal 90° pin mount with either standard or short pin

The grids lie in the same plane as the solution flow

A practical way to store and dispense AFM/STM discs

Consumption rate: 0

Ultra-Flat SiNx Coated Substrates Size:10 x 10mm pieces in a Gel-Pak® box Hot embedding press is neededDESCRIPTION PRODUCT SPECIFICATIONS Ultra Flat SiNx Coated Substrates The Ultra Flat SiNx Substrates consist of ultra flat silicon wafers coated with 200nm of amorphous nonstoichiometric ultra low stress silicon nitride, similar to our silicon nitride grids. The ultra flat SiNx substrates are available in 6" wafer and conveniently diced 5 x 5mm, 5 x 7mm, and 10 x 10mm chips. The 6" wafer is shipped in a 6" wafer carrier; the diced pieces are shipped in

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
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