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Substratek™ TEM Metallic Substrates on 400 mesh TEM grids Material:Platinum Packaging for the Cu and

SKU: 5015864302

4.3
USD169.90 USD205.90

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Description

Packaging for the Cu and Ni grids is 100/vial and for Au grids 25/vial

pp 324-325

01830 - Formvar / Silicon Monoxide

16 N/m nominal

Excellent wear resistance and resistance to most solvents and fuels

Substratek™ TEM Metallic Substrates on 400 mesh TEM grids Material:Platinum Packaging for the Cu andDESCRIPTION Innovative experimental nanotech TEM supports Substratek TEM Substrates are ultrathin metallic support films on standard 3mm TEM grids. These metallic films are specially manufactured with a patented process (US Patent #7348570 B2, March 25, 2008) as experimental platforms and are electron transparent to allow for imaging using a TEM. The ultrathin Substratek TEM Substrates enable electrochemical processing, crystal growth, and nano and

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